Description
Key Features:
- Up to 24.85 miles (40km) transmission distance
- Cooled DWDM EML transmitter and PIN receiver
- Hot Z-Pluggable
- XAUI Electrical Interface has 4 transmit and receive Lanes operates at a rate of 3.125Gbit/s
- MDIO, DOM Support
- SC-Duplex Optical Receptacle
- Compliant to IEEE 802.3ae 10GBASE-ER Application
- Compliant to XENPAK MSA
- Case Operating Temperature Range from 32 °F to 158 °F (0°C to 70°C)
Technical Specifications:
Working Range | Up to 24.85 miles (40km) |
Standards | 10GBASE-ER as per IEEE 802.3ae.
XENPAK MSA. RoHS complaint. Class 1 Laser Product. |
Data rate | 10Gb/s |
Wavelength | C-band |
Connector | SC |
Transmitter | DWDM EML |
Receiver | PIN |
Fiber type | single-mode |
Optical Output Power | -1 dBm to +4 dBm |
Receiver Sensitivity | -16.5 dBm |
Supply Voltage | 3.3V, 1.2V |
Maximum Power Consumption | 4W |
Baud rate | 3.125 Gbit/s |
Digital Optical Monitoring | Enabled |
Dimensions | 4.76in x 1.42in x 0.46in (L 121mm x W36mm x H 11.6mm) |
Relative Humidity | 5% to 95% |
Storage Temperature | -40 °F to 185 °F (-40°C to 85°C) |
Case Operating Temperature | 32 °F to 158 °F (0 °C to 70 °C) |
Ordering Information:
Product ID | Media | Wavelength | Transmission Distance | Temperature Range | Supply Current |
GAO-XKDW-102
|
Single-mode fiber | Refer to Wavelength | 24.85miles (40km) | 32°F to 158°F (0°C to +70°C) | 1.2 A (ICC1)
1.7 A (ICC2) |
Product Selection:
C-band λc Wavelength Guide Pin Descriptions:
ITU Channel Product Code | Wavelength(nm) | Frequency(THZ) | Channel | Wavelength(nm) | Frequency(THZ) |
17 | 1563.86 | 191.7 | 39 | 1546.12 | 193.9 |
18 | 1563.05 | 191.8 | 40 | 1545.32 | 194.0 |
19 | 1562.23 | 191.9 | 41 | 1544.53 | 194.1 |
20 | 1561.42 | 192.0 | 42 | 1543.73 | 194.2 |
21 | 1560.61 | 192.1 | 43 | 1542.94 | 194.3 |
22 | 1559.79 | 192.2 | 44 | 1542.14 | 194.4 |
23 | 1558.98 | 192.3 | 45 | 1541.35 | 194.5 |
24 | 1558.17 | 192.4 | 46 | 1540.56 | 194.6 |
25 | 1557.36 | 192.5 | 47 | 1539.77 | 194.7 |
26 | 1556.55 | 192.6 | 48 | 1538.98 | 194.8 |
27 | 1555.75 | 192.7 | 49 | 1538.19 | 194.9 |
28 | 1554.94 | 192.8 | 50 | 1537.40 | 195.0 |
29 | 1554.13 | 192.9 | 51 | 1536.61 | 195.1 |
30 | 1553.33 | 193.0 | 52 | 1535.82 | 195.2 |
31 | 1552.52 | 193.1 | 53 | 1535.04 | 195.3 |
32 | 1551.72 | 193.2 | 54 | 1534.25 | 195.4 |
33 | 1550.92 | 193.3 | 55 | 1533.47 | 195.5 |
34 | 1550.12 | 193.4 | 56 | 1532.68 | 195.6 |
35 | 1549.32 | 193.5 | 57 | 1531.90 | 195.7 |
36 | 1548.51 | 193.6 | 58 | 1531.12 | 195.8 |
37 | 1547.72 | 193.7 | 59 | 1530.33 | 195.9 |
38 | 1546.92 | 193.8 | 60 | 1529.55 | 196.0 |
61 | 1528.77 | 196.1 |
Electrical characteristics:
Parameter | Symbol | Min | Type | Max | Unit | Remarks |
Supply Voltage | VCC1 | 3.135 | 3.300 | 3.465 | V | |
Supply Voltage | VCC2 | 1.152 | 1.200 | 1.248 | V | |
Supply Current | ICC1 | – | – | 1.2 | A | +3.3V |
Supply Current | ICC2 | – | – | 1.7 | A | APS |
Power Consumption | PDS | – | – | 4.0 | W | |
Power supply stabilization time | TDF | – | – | 500 | ms | |
Initialization Time | TINIT | – | – | 5 | S | |
RESET Assert Time | TRESET | 1 | – | – | ms | |
Hold Time after rising edge of RESET | THOLD | 500 | – | – | ms |
Optical Characteristics:
Parameter | Symbol | Min | Type | Max | Unit |
Transmitter | |||||
Average Optical Output Power | Pout | -1 | +4 | dBm | |
Center Wavelength(BOL) | λC | λc -25 | λC | λc +25 | pm |
Signaling speed | – | 10.3125 | – | Gbit/s | |
Center Wavelength(EOL) | λC | λc -100 | λC | λc +100 | pm |
Optical Extinction Ratio | ER | 8.2 | dB | ||
Average Launch power of transmitter | POFF | -30 | dBm | ||
Side Mode Suppression Ratio | SMSR | 30 | – | – | dB |
Optical modulation amplitude | OMA | -2.1 | – | – | dBm |
Signaling speed variation from nominal | -100 | – | +100 | ppm | |
Receiver | |||||
Receiver Sensitivity | RSENS | – | -16.5 | dBm | |
Average Receiver Overload | Rro | 0.5 | – | – | dBm |
Average Receiver Return Loss | RL | 12 | – | – | dB |
CMOS Interface characteristics:
Parameter | Symbol | Min | Type | Max | Unit | Remarks |
Input High Voltage | VIH | 0.84 | – | 1.5 | V | |
Input Low Voltage | VIL | -0.3 | – | 0.36 | V | |
Input Pull-down Current | IIn | 20 | 40 | 120 | µA | Vih=1.2V |
Output High Voltage | VOH | 1.0 | – | – | V | Pull-up=10k
ohm to 1.2V |
Output Low Voltage | VOL | – | – | 0.2 | V | |
Pull up Resistance | RLASI | 10 | – | 22 | K ohm | |
Capacitance | CLASI | – | – | 10 | pF | |
Load Capacitance | CLoad | – | – | 320 | pF |
XAUI Driver characteristics:
Parameter | Symbol | Min | Type | Max | Unit | Remarks |
Baud Rate | – | 3.125 | – | Gbit/s | ||
Baud Rate Tolerance | -100 | – | +100 | ppm | ||
Differential Amplitude | 800 | – | 1600 | mVPP | AC, near-end value |
MDIO Bidirectional Interface characteristics:
Parameter | Symbol | Min | Type | Max | Unit | Remarks |
Input High Voltage | VIHM | 0.84 | – | 1.5 | V | |
Input Low Voltage | VILM | -0.3 | – | 0.36 | V | |
Output High Voltage | VOHM | 1.0 | – | 1.5 | V | |
Output Low Voltage | VOLM | -0.3 | – | 0.2 | V | |
Pull up Resistance | RMDIO | 200 | – | Ohm | 1 | |
MDC min high/low time | THM,TLM | 160 | – | – | ns | |
MDC Frequency | 1/TCK | TBD | – | 2.5 | MHz | |
Setup time | TDIS | 10 | – | – | ns | |
Hold time | TDIH | 10 | – | – | ns | |
MDIO output delay after rising edge of MDC | TPD | 0 | – | 300 | ns | |
Input Capacitance | Ci | – | – | 10 | pF | |
Bus Loading | CL | – | – | 470 | pF |
Note:
- The maximum value of RMDIO depends on bus loading (CL), input capacitance (Ci), and MDC frequency (1/TCK).
XENPAK Transponder Electrical Pad Layout:
Pin Configuration:
Pin# | Symbol | I/O | Logic | Description |
1 | GND | I | Supply | Electrical ground |
2 | GND | I | Supply | Electrical ground |
3 | GND | I | Supply | Electrical ground |
4 | RESERVED | – | – | Reserved |
5 | 3.3V | I | Supply | Power |
6 | 3.3V | I | Supply | Power |
7 | APS | I | Supply | Adaptive Power Supply |
8 | APS | I | Supply | Adaptive Power Supply |
9 | LASI | O | Open Drain | Link Alarm Status Interrupt. 10-22k ohm pull up on host. |
10 | RESET | I | 1.2V CMOS | TX OFF when MDIO RESET |
11 | VEND SPECIFIC | – | – | Vendor Specific Pin. Leave unconnected. |
12 | TX ON/OFF | I | 1.2V CMOS | Transmitter ON/OFF |
13 | RESERVED | – | – | Reserved |
14 | MOD DETECT | O | – | Pulled low inside module through 1k Ohm |
15 | VEND SPECIFIC | – | – | Vendor Specific Pin. Leave unconnected. |
16 | VEND SPECIFIC | – | – | Vendor Specific Pin. Leave unconnected. |
17 | MDIO | I/O | Open Drain | Management Data IO |
18 | MDC | I | 1.2V CMOS | Management Data Clock |
19 | PRTAD4 | I | 1.2V CMOS | Port Address bit 4 (Low=0) |
20 | PRTAD3 | I | 1.2V CMOS | Port Address bit 3 (Low=0) |
21 | PRTAD2 | I | 1.2V CMOS | Port Address bit 2 (Low=0) |
22 | PRTAD1 | I | 1.2V CMOS | Port Address bit 1 (Low=0) |
23 | PRTAD0 | I | 1.2V CMOS | Port Address bit 0(Low=0) |
24 | VEND SPECIFIC | – | – | Vendor Specific Pin. Leave unconnected |
25 | APS SET | O | – | Feedback output for APS |
26 | RESERVED | – | – | Reserved for Avalanche Photodiode use |
27 | APS SENSE | O | Analog | APS Sense Connection |
28 | APS | I | Supply | Adaptive Power Supply |
29 | APS | I | Supply | Adaptive Power Supply |
30 | 3.3 V | I | Supply | Power |
31 | 3.3 V | I | Supply | Power |
32 | RESERVED | – | – | Reserved |
33 | GND | I | Supply | Electrical Ground |
34 | GND | I | Supply | Electrical Ground |
35 | GND | I | Supply | Electrical Ground |
36 | GND | I | Supply | Electrical Ground |
37 | GND | I | Supply | Electrical Ground |
38 | RESERVED | – | – | Reserved |
39 | RESERVED | – | – | Reserved |
40 | GND | I | Supply | Electrical Ground |
41 | RX LANE 0+ | O | AC | Module XAUI Output Lane 0+ |
42 | RX LANE 0- | O | AC | Module XAUI Output Lane 0- |
43 | GND | I | Supply | Electrical Ground |
44 | RX LANE 1+ | O | AC | Module XAUI Output Lane 1+ |
45 | RX LANE 1- | O | AC | Module XAUI Output Lane 1- |
46 | GND | I | Supply | Electrical Ground |
47 | RX LANE 2+ | O | AC | Module XAUI Output Lane 2+ |
48 | RX LANE 2- | O | AC | Module XAUI Output Lane 2- |
49 | GND | I | Supply | Electrical Ground |
50 | RX LANE 3+ | O | AC | Module XAUI Output Lane 3+ |
51 | RX LANE 3- | O | AC | Module XAUI Output Lane 3- |
52 | GND | I | Supply | Electrical Ground |
53 | GND | I | Supply | Electrical Ground |
54 | GND | I | Supply | Electrical Ground |
55 | TX LANE 0+ | I | AC | Module XAUI Input Lane 0+ |
56 | TX LANE 0- | I | AC | Module XAUI Input Lane 0+ |
57 | GND | I | Supply | Electrical Ground |
58 | TX LANE 1+ | I | AC | Module XAUI Input Lane 1+ |
59 | TX LANE 1- | I | AC | Module XAUI Input Lane 1- |
60 | GND | I | Supply | Electrical Ground |
61 | TX LANE 2+ | I | AC | Module XAUI Input Lane 2+ |
62 | TX LANE 2- | I | AC | Module XAUI Input Lane 2- |
63 | GND | I | Supply | Electrical Ground |
64 | TX LANE 3+ | I | AC | Module XAUI Input Lane 3+ |
65 | TX LANE 3- | I | AC | Module XAUI Input Lane 3- |
66 | GND | I | Supply | Electrical Ground |
67 | RESERVED | – | – | Reserved |
68 | RESERVED | – | – | Reserved |
69 | GND | I | Supply | Electrical Ground |
70 | GND | I | Supply | Electrical Ground |
Note: Case is connected to electrical ground in the module.
Register Definition:
Device Address (Dec) Register Address (Hex) | PMA/PMD 1 | PCS 3 | PHY XS 4 |
0x0000 | PMA/PMD Control1 | PCS Control1 | PHY XS Control1 |
0x0001 | PMA/PMD Status1 | PCS Status1 | PHY XS Status1 |
0x0002 | PMA/PMD Device Identifier0 | PCS Device Identifier0 | PHY XS Device Identifier0 |
0x0003 | PMA/PMD Device Identifier1 | PCS Device Identifier1 | PHY XS Device Identifier1 |
0x0004 | PMA/PMD Speed Ability | PCS Speed Ability | PHY XS Speed Ability |
0x0005 | PMA/PMD Device in Package1 | PCS Device in Package1 | PHY XS Device in Package1 |
0x0006 | PMA/PMD Device in Package2 | PCS Device in Package2 | PHY XS Device in Package2 |
0x0007 | 10G PMA/PMD Control2 | PCS Control2 | Reserved |
0x0008 | 10G PMA/PMD Status2 | PCS Status2 | PHY XS Status2 |
0x0009 | 10G PMD Transmit Disable | Reserved | Reserved |
0x000A | 10G PMD Receive Signal O.K. | Reserved | Reserved |
0x000E | Package Identifier0 | Reserved | Reserved |
0x000F | Package Identifier1 | Reserved | Reserved |
0x0018 | Reserved | Reserved | 10G PHY XGXS Lane Status |
0x0019 | Reserved | Reserved | 10G PHY XGXS Test Control |
0x0020 | Reserved | 10GBASE-R PCS Status1 | Reserved |
0x0021 | Reserved | 10GBASE-R PCS Status2 | Reserved |
0x0022 | Reserved | 10GBASE-R PCS Test pattern Seed A0 | Reserved |
0x0023 | Reserved | 10GBASE-R PCS Test pattern Seed A1 | Reserved |
0x0024 | Reserved | 10GBASE-R PCS Test pattern Seed A2 | Reserved |
0x0025 | Reserved | 10GBASE-R PCS Test pattern Seed A3 | Reserved |
0x0026 | Reserved | 10GBASE-R PCS Test pattern Seed B0 | Reserved |
0x0027 | Reserved | 10GBASE-R PCS Test pattern Seed B1 | Reserved |
0x0028 | Reserved | 10GBASE-R PCS Test pattern Seed B2 | Reserved |
0x0029 | Reserved | 10GBASE-R PCS Test pattern Seed B3 | Reserved |
0x002A | Reserved | 10GBASE-R PCS Test pattern Control | Reserved |
0x002B | Reserved | 10GBASE-R PCS Test pattern Error counter | Reserved |
0x8000 | NVR Control/Status (XENPAK Register) | Reserved | |
0x8007 – 0x807D | NVR (XENPAK Register) | Reserved | |
0x807E- 0x80AD | Customer AREA | Reserved | |
0x80AE – 0x8106 | GAOTek Specific Area(XENPAK Register) | Reserved | |
0x9000 | RX_ALARM Control (XENPAK Register) | Reserved | |
0x9001 | TX_ALARM Control (XENPAK Register) | Reserved | |
0x9002 | LASI Control (XENPAK Register) | Reserved | |
0x9003 | RX_ALARM Status (XENPAK Register) | Reserved | |
0x9004 | TX_ALARM Status (XENPAK Register) | Reserved | |
0x9005 | LASI Status (XENPAK Register) | Reserved | |
0x9006 | TX_FLAG Control Bits | Reserved | |
0x9007 | RX_FLAG Control Bits | Reserved | |
0xA000 – 0xA027 | Alarm and Warning Thresholds | Reserved | |
0xA060 – 0xA069 | Digital Optical Monitoring Interface | Reserved | |
0xA06F | DOM Capability – Extended | Reserved | |
0xA070 | TX_ALARM_FLAG Bits | Reserved | |
0xA071 | RX_ALARM_FLAG Bits | Reserved | |
0xA074 | TX_WARNING_FLAG Bits | Reserved | |
0xA075 | RX_WARNING_FLAG Bits | Reserved | |
0xA100 | Optional Digital Optical Monitoring (DOM) Control/Status | Reserved |
Mechanical Dimensions:
Regulatory Compliance:
Feature | Reference | Performance |
Laser Eye Safety | FDA 21CFR 1040.10, 1040.11 IEC/EN 60825-1,2 | Class 1 laser product |
Component Recognition | IEC/EN 60950, UL | Compatible with standards |
ROHS | 2002/95/EC | Compatible with standards |
Electrostatic discharge(ESD) | IEC/EN 61000-4-2 | Compatible with standards |
EMC | EN61000-3 | Compatible with standards |
Electromagnetic Interference(EMI) | FCC Part 15 Class B EN 55022 Class B (CISPR 22A) | Compatible with standards |