Description
Features
- Pixel Pitch 140 μm
- Pixel Matrix 1792 x 2048
- ADC 16-bit
- Gain Stage Multi-Gain
- Scintillator CSI or GOS
- Waterproof IPX0
- Calibration Firmware, Software
- Radiation Hardness ≥ 10000 Gy
Technical Specifications
| Sensor | A-Si |
| Scintillator | CSI / GOS |
| Active Area | 9.84 in x 11.26 in (250 mm x 286 mm) |
| Pixel Matrix | 1792 x 2048 |
| Pixel Pitch | 140 μm |
| AD Conversion | 16 bits |
| Communication Interface | Gigabit Ethernet |
| Exposure Control | Pulse Sync In (Edge or Level) or Pulse Sync Out (Edge or Level) |
| Mode | Software Mode or HVG Sync Mode or FPD Sync Mode |
| Frame Speed | 10 fps (1 x 1) |
| Operating System | Windows7 or Windows10 OS 32 bits or 64 bits |
| Resolution | 3.5 lp or mm |
| Energy Range | 40 KV to 160 KV |
| Lag | ≤ 1 % at 1st frame |
| Dynamic Range | ≥ 86 dB |
| Sensitivity | 540 lsb or uGy |
| SNR | 48 dB at (20000 lsb) |
| MTF | 70 % at (1 lp / mm) 38 % at (2 lp / mm) 21 % at (3 lp / mm) |
| DQE | 58 % at (0 lp / mm) 41 % at (1 lp / mm) 25 % at (2 lp / mm) |
| Sensor Protection Material | Carbon Fiber |
| Housing Material | Aluminum Alloy |
| Humidity | 30 % to 70 % RH (non-condensing) |
| Vibration | IEC or EN 60721-3 class 2M3(10 Hz to 150 Hz,0.5 g) |
| Shock | IEC/EN 60721-3 class 2M3(11 ms,2 g) |
| Dust and Water Resistant | IPX0 |
| Supply | 100 V to 240 V AC |
| Frequency | 50 Hz or 60 Hz |
| Consumption | 10 W |
| Industry | SMT, Electronics, Lithium Battery, and Chip Wire Bonding Inspection |
| Temperature Range | 82 °F to 95 °F (10 °C to 35 °C) (operating) 14 °F to 122 °F (-10 °C to 50 °C) (storage) |
| Dimension | 12.68 in × 11.22 in × 1.83 in (322 mm x 285 mm x 46.5 mm) |
| Weight | 5.51 lb (2.5 Kg) |