Description
Technical Specifications
| Chipset | 890 |
| Application | Wireless communication |
| Working Voltage | AC 220V ±20V |
| Protocol | Modbus TCP or RTU or DTL645 or MQTT |
| Interfaces | RS485 or 4G or NB IoT or Wi-Fi or 2G or LoRa |
| Ethernet | 2 RJ45 (100M) |
| Electrostatic Discharge Immunity | IEC 61000-4-2- III level |
| Immunity Of Electric Fast Transient Pulse Group | IEC 61000-4-4- IV level |
| Radiofrequency Electromagnetic Radiation Immunity | IEC 61000-4-3- III level |
| Impact (surge) Immunity | IEC 61000-4-5- IV level |
| Relative Humidity | ≤95%RH |
| Interface | Two RJ45(100M), electrostatic 6 KV |
| Protection Level | IP20 |
| Insulation | Double insulation |
| LED | 1Rd.running light ,2Rd. RS485 lights ,1Rd. Ethernet light ,1Rd. wireless light |
| Size | 2.40in x 2.40in x 0.06in (61mm x 61mm x 15mm) |
| Working Temperature |
-13°F to 158°F (-25 to 70℃) |
| Storage Temperature | -40°F to 185°F (-40C to +85℃) |