Description
Features
- High-performance 5G wireless modules compliant with 3GPP R17 specifications.
- Support for both SA and NSA network architectures. Compatibility with global 5G frequency bands and certifications.
- Excellent uplink capabilities, including FDD+FDD uplink carrier aggregation and FDD uplink MlMO.
- Supports 1024QAM modulation, 300MHz bandwidth and supports downlink NR 5 Carrier Aggregation.
Technical Specifications
| Chipset | SDX75 |
| 5G Sub 6 | n1 or 2 or 3 or 5 or 7 or 8 or 12 or 13 or 14 or 18 or 20 or 25 or 26 or 29 or 30 or 34 or 38 or 39 or 40 or 41 or 46 or 48 or 53 or 66 or 67 or 68 or 70 or 71 or 75 or 76 or 77 or 78 or 79 or 90 or 91 or 92 or 93 or 94 |
| LTE FDD/TDD | TDD B34 or 38 or 39 or 40 or 41 or 48 or 46 or 53 FDD B1 or 2 or 3 or 4 or 5 or 7 or 8 or 12 or 13 or 14 or 17 or 18 or 19 or 20 or 25 or 26 or 28 or 29 or 30 or 32 or 66 or 70 or 71 or 75 or 76 |
| UMTS | B1 or 2 or 3 or 4 or 5 or 6 or 8 or 9 or 19 |
| CDMA | B0 or 1 or 10 |
| Antenna | Antenna |
| Power Supply | 3.135V to 4.4V, Typical 3.8V |
| Memory | 8Gb LPDDR4x+8Gb Nand Flash |
| Software Support | OpenWRT or RDK B |
| Driver | USB: Linux 2.6.38 and later/Windows7&10/Android7.x&8.x&9.x RIL: Android7.x&8.x&9.x NDIS: Windows7&10 ECM: Linux 2.6.38 and later Gobinet: Linux 2.6.38 and later |
| QMI WWAN | Linux 3.4 and later |
| Operating Temp. | -40 °F to 185 °F ( -40 °C to +85° C) |
| Dimension | 1.18 in x 2.05 in x 0.08 in (3 cm x 5.2 cm x 0.2 cm) |