Description
Features
- Up to 1.25 Gb/ s bi-directional data links
- Hot-pluggable SFP footprint
- Extended case temperature range 32 ºF to 158 ºF (0 ºC to 70 ºC)
- Fully metallic enclosure for low EMI
- Low power dissipation
- Compact RJ – 45 connector assembly
- Access to physical layer IC via 2 – wire serial bus
- 1000 BASE – T operation in host systems with SERDES interface
- 10 / 100/ 1000 Mbps compliant in host systems with SGMII interface
Technical Specifications
| Network | Wired LAN, 4g, 3G |
| Data Rate | 1000 Mbps |
| Distance | 100 m |
| Power dissipation | 1.05 W |
| Connector Type | RJ 45 |
| Data link | 1.25 Gb/ s |
| Temperature | 32 ºF to 158 ºF (0 ºC to 70 ºC) |