Description
Features
- Industrial-Grade Application
- High to Performance Chipset
- Extended Communication Range
- Powerful Output
- Multi to Band LTE Support
- Flexible Network Compatibility
- Wide Voltage Range
- High Humidity Resilience
- Compact and Durable Design
Technical Specifications
| Chip Scheme | SX1302 |
| Frequency | CN470 |
| Power | 27dBm |
| Communication Distance | 3km |
| Weight | 14.70 oz (417gm) |
| Size | 4.56 Inch x 4.13 Inch x 1.61 Inch (116 mm x 105 mm x 41 mm) |
| TDD-LTE | Downlink rate 130Mbps, uplink rate 35Mbps |
| FDD-LTE | Downlink rate 384kbps, uplink rate 384kbps |
| DC-HSDPA | Downlink rate 42Mbps |
| HSUPA | Uplink rate 5.76Mbps |
| GPRS | Downlink rate 107bps, uplink rate 85.6kbps |
| Voltage | 8V to 28V |
| Temperature | -40°F to 185°F (-40℃ to +85℃) |
| Humidity | 5% RH to 95% RH |