Description
Features
- Higher image quality
- Larger dynamic range
- LONG life span
- Multi-gain stage
Technical Specification
Sensor | A-Si |
Scintillator | GOS / CSI |
Active Area | 6.299 in × 5.03 in (160 mm x 128 mm) |
Pixel Matrix | 1024 pixels x 1248 pixels |
Pixel Pitch | 125 μm |
AD Conversion | 16 bits |
Communication Interface | Gigabit Ethernet |
Exposure Control | Pulse Sync In (Edge or Level) / Pulse Sync Out (Edge or Level) |
Mode | Software Mode / HVG Sync Mode / FPD Sync Mode |
Frame Speed | 30 fps |
Operating System | Windows 7 / Windows 10 OS 32 bits or 64 bits |
Resolution | 4.0 lp |
Energy Range | 40 KV to 160 KV |
Lag | 0.8% at 1st frame |
Dynamic Range | ≥86 dB |
Sensitivity | 460 lsb /uGy |
SNR | 49 dB at(20000 lsb) |
MTF | 75% at(1 lp/mm)46% at(2 lp/mm)
27% at(3 lp/mm) |
DQE | 58% at(0 lp/mm)43% at(1 lp/mm)
30% at(2 lp/mm) |
Dimension(HxWxD) | 7.71 in × 6.37 in × 1.47 in ( 196 mm × 162 mm × 37.5 mm) |
Weight | 3.3 lb (1.5 kg) |
Sensor Protection Material | Carbon Fiber |
Housing Material | Aluminum Alloy |
Temperature Range | 50 °F to 95° F (10 °C to 35 °C) |
Humidity | 30% RH to 70% RH (non-condensing) |
Vibration | IEC/EN 60721-3 class 2 M3(10 Hz to 150 Hz ) |
Shock | IEC/EN 60721-3 class 2 M3(11 ms, 2 g) |
Supply | 100 V AC to 240 V AC |
Frequency | 50 Hz to 60 Hz |
Consumption | 8 W |
Industry | SMT, Electronics, Lithium Battery Chip and Wire Bonding Inspection |